Substrate processing apparatus and method of manufacturing semiconductor device

Invention Grant

US10763137B2 Substrate processing apparatus and method of manufacturing semiconductor device 有权

Patent Title: Substrate processing apparatus and method of manufacturing semiconductor device
Application No.: US16542400

Application Date: 2019-08-16
Publication No.: US10763137B2

Publication Date: 2020-09-01
Inventor: Satoshi Takano
Applicant: KOKUSAI ELECTRIC CORPORATION
Applicant Address: JP Tokyo
Assignee: KOKUSAI ELECTRIC CORPORATION
Current Assignee: KOKUSAI ELECTRIC CORPORATION
Current Assignee Address: JP Tokyo
Agency: Volpe and Koenig, P.C.
Main IPC: G03D5/00
IPC: G03D5/00 ; H01L21/67 ; C23C16/44 ; H01L21/677

Abstract:

For enhancing productivity, an apparatus comprises a vertical type process furnace configured to simultaneously process N substrates (1

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IPC分类:

G	物理
G03	摄影术；电影术；利用了光波以外其他波的类似技术；电记录术；全息摄影术
G03D	加工曝光后的照相材料的设备；其附件
G03D5/00	无浸渍作用的液体加工设备；无浸渍作用的水洗设备（G03D9/00，G03D11/00优先）