Invention Grant
- Patent Title: Integrated circuit device
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Application No.: US16165294Application Date: 2018-10-19
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Publication No.: US10763156B2Publication Date: 2020-09-01
- Inventor: Jae-yup Chung , Il-ryong Kim , Ju-youn Kim , Jin-wook Kim , Kyoung-hwan Yeo , Yong-gi Jeong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@95e7c74
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/762 ; H01L27/092 ; H01L27/088

Abstract:
An integrated circuit device includes a substrate having a first region and a second region, a first fin-isolation insulating portion in each of the first region and the second region and having a first width in a first direction, a pair of fin-type active regions spaced apart from each other in each of the first region and the second region with the first fin-isolation insulating portion therebetween, and extending in a straight line in the first direction, a pair of second fin-isolation insulating portions contacting, in each of the first region and the second region, two side walls of the first fin-isolation insulating portion, respectively, each of the two side walls facing the opposite sides in the first direction, and a plurality of gate structures extending in the second direction and comprising a plurality of dummy gate structures.
Public/Granted literature
- US20190326158A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2019-10-24
Information query
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