Invention Grant
- Patent Title: Method of processing wafer
-
Application No.: US16233833Application Date: 2018-12-27
-
Publication No.: US10763172B2Publication Date: 2020-09-01
- Inventor: Kazuma Sekiya
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5b6255ea
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/768 ; H01L21/683 ; H01L21/268
Abstract:
A method of processing a wafer having a face side where devices are formed in respective areas demarcated by a grid of projected dicing lines includes a groove forming step, a protective film sticking step, a protective-member-combined wafer forming step, a grinding step, a tape bonding step, a holding step, a peeling step, and a die-attach film dividing step.
Public/Granted literature
- US20190206734A1 METHOD OF PROCESSING WAFER Public/Granted day:2019-07-04
Information query
IPC分类:
