Invention Grant
- Patent Title: Electrical devices and methods for forming electrical devices
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Application No.: US16079105Application Date: 2016-03-24
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Publication No.: US10763218B2Publication Date: 2020-09-01
- Inventor: Sruti Chigullapalli , Leslie Fitch , Boping Wu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: 2SPL Patent Attorneys PartG mbB
- Agent Kieran O'Leary
- International Application: PCT/US2016/023868 WO 20160324
- International Announcement: WO2017/164873 WO 20170928
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/60 ; H01L23/10 ; H01L23/367 ; H01L23/498 ; H01L25/065 ; H05K9/00 ; H05K7/20 ; H01L23/42
Abstract:
An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.
Public/Granted literature
- US20190074252A1 Electrical Devices and Methods for Forming Electrical Devices Public/Granted day:2019-03-07
Information query
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