Invention Grant
- Patent Title: Integrated assemblies having continuous high-dielectric films extending across channel regions of adjacent transistors
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Application No.: US16654172Application Date: 2019-10-16
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Publication No.: US10763265B2Publication Date: 2020-09-01
- Inventor: Takuya Imamoto , Takeshi Nagai , Yoichi Fukushima
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: G11C7/00
- IPC: G11C7/00 ; H01L27/108 ; G11C11/4091 ; H01L29/49 ; H01L27/092 ; H01L29/51

Abstract:
Some embodiments include an integrated assembly having a first transistor adjacent to a second transistor. The first transistor has a first conductive gate material over a first insulative region, and the second transistor has a second conductive gate material over a second insulative region. A continuous high-k dielectric film extends across both of the first and second insulative regions. In some embodiments, the transistors may be incorporated into a sense amplifier.
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