Invention Grant
- Patent Title: Silicon carbide semiconductor element and method for manufacturing same
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Application No.: US16254881Application Date: 2019-01-23
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Publication No.: US10763330B2Publication Date: 2020-09-01
- Inventor: Tsutomu Kiyosawa
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@43d770b2
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/16 ; H01L29/06 ; H01L29/08 ; H01L29/36 ; H01L21/02 ; H01L29/66 ; H01L29/78 ; H01L29/417 ; H01L29/739

Abstract:
A silicon carbide semiconductor element includes a silicon carbide semiconductor layer of a first conductivity type, a body region of a second conductivity type, a channel layer made of a silicon carbide semiconductor disposed on the silicon carbide semiconductor layer so as to be in contact with at least a part of the body region, and a gate electrode disposed on the channel layer via a gate insulating film. The channel layer has a multilayer structure of a high-concentration impurity layer containing impurities of the first conductivity type, a first medium-concentration impurity layer containing impurities of the first conductivity type, and a first low-concentration impurity layer containing impurities of the first conductivity type. The first low-concentration impurity layer is disposed closer to the body region than the high-concentration impurity layer and the first medium-concentration impurity layer.
Public/Granted literature
- US20190245039A1 SILICON CARBIDE SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SAME Public/Granted day:2019-08-08
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