Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16121346Application Date: 2018-09-04
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Publication No.: US10763336B2Publication Date: 2020-09-01
- Inventor: Hiroshi Yanagigawa
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3bfeedaf
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/088 ; H01L29/06 ; H01L29/417 ; H01L21/8234 ; H01L29/78 ; H01L29/08 ; H01L21/265 ; H02H7/18 ; H01L29/49 ; H01L21/308 ; H01L21/02

Abstract:
A semiconductor device which simplifies the manufacturing process while decreasing the width of separation between a first MOS transistor area and a second MOS transistor area, and a method for manufacturing the semiconductor device. A first MOS transistor and a second MOS transistor configure a bidirectional switch. The first MOS transistor and second MOS transistor each have a vertical trench structure. A first impurity region abuts on the side wall of a first gate trench of a first MOS transistor element outside the first MOS transistor area and is electrically coupled to a first source region.
Public/Granted literature
- US20190097008A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-03-28
Information query
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