Invention Grant
- Patent Title: Fabrication of gate all around device
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Application No.: US16443769Application Date: 2019-06-17
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Publication No.: US10763337B2Publication Date: 2020-09-01
- Inventor: Yung-Chih Wang , Yu-Chieh Liao , Tai-I Yang , Hsin-Ping Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/786

Abstract:
A method of forming a gate-all-around device includes forming a gate electrode layer over a substrate, patterning the gate electrode layer to form a conical frustum-shaped gate electrode, etching the conical frustum-shaped gate electrode to form a through hole extending through top and bottom surfaces of the conical frustum-shaped gate electrode, and after etching the conical frustum-shaped gate electrode, forming a nanowire in the through hole in the conical frustum-shaped gate electrode.
Public/Granted literature
- US20190305100A1 FABRICATION OF GATE ALL AROUND DEVICE Public/Granted day:2019-10-03
Information query
IPC分类: