An optical module includes an electronic assembly and an optical assembly. The electronic assembly includes a circuit board and a chip component. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.