Invention Grant
- Patent Title: Method for forming an electrical interconnect
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Application No.: US14843181Application Date: 2015-09-02
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Publication No.: US10763376B1Publication Date: 2020-09-01
- Inventor: John S. Frost , Randolph J. Brandt , Peter Hebert , Omar Al Taher
- Applicant: John S. Frost , Randolph J. Brandt , Peter Hebert , Omar Al Taher
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Moor IP Law
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H05K1/02 ; H05K3/40 ; H01R43/02

Abstract:
A method including forming an interconnect in a metal member. The interconnect includes multiple repeating, nested V-shaped structures forming a continuous central portion. A vertex of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of a next V-shaped structure of the multiple repeating, nested V-shaped structures. The method further includes separating the interconnect from the metal member.
Information query
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