Invention Grant
- Patent Title: MEMS piezoelectric transducer formed at a PCB support structure
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Application No.: US15411971Application Date: 2017-01-21
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Publication No.: US10763423B2Publication Date: 2020-09-01
- Inventor: Jonathan Silvano De Sousa , Nick Renaud-Bezot
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7554ff44
- Main IPC: H01L41/053
- IPC: H01L41/053 ; H01L41/09 ; H01L41/312 ; H04R17/00 ; H01L41/311 ; H04R31/00 ; B81B3/00 ; B81C1/00 ; H01L41/047 ; H01L41/113
Abstract:
A microelectro-mechanical system (MEMS) device includes a support structure formed of printed circuit board (PCB) materials; and a piezoelectric transducer formed at the support structure. Further, a MEMS assembly is described which shows such a MEMS device mounted at a component carrier. Furthermore, a method for manufacturing such a MEMS device is described.
Public/Granted literature
- US20170213955A1 MEMS Piezoelectric Transducer Formed at a PCB Support Structure Public/Granted day:2017-07-27
Information query
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