Invention Grant
- Patent Title: Electronic connector sealing system
-
Application No.: US16545692Application Date: 2019-08-20
-
Publication No.: US10763612B1Publication Date: 2020-09-01
- Inventor: Ryan Michael Soroka , David William Lindbloom
- Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Applicant Address: US MO Kansas City
- Assignee: Honeywell Federal Manufacturing & Technologies, LLC
- Current Assignee: Honeywell Federal Manufacturing & Technologies, LLC
- Current Assignee Address: US MO Kansas City
- Agency: Hovey Williams LLP
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R13/436 ; H01R11/28

Abstract:
An electronic sealing system for sealing and shielding an electronic connector from detrimental liquid cleaners that are applied with or without pressure. The electronic sealing system includes a U-shaped holder, a gasket frame, a gasket, a top plate, and several fasteners. The U-shaped holder cradles the electronic connector. The gasket frame abuts a top side of the holder and includes an aperture. The gasket engages a portion of the connector via the aperture. The top plate abuts the gasket frame opposite the holder so as to encapsulate the gasket over the aperture and hence over a portion of the electronic connector. The fasteners secure the U-shaped holder, gasket frame, and top plate together so that the electronic connector is secured with the holder and so that a portion of the electronic connector is sealed via the gasket.
Information query