Invention Grant
- Patent Title: High-frequency power amplifier
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Application No.: US16094797Application Date: 2016-05-19
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Publication No.: US10763797B2Publication Date: 2020-09-01
- Inventor: Takaaki Yoshioka , Masatake Hangai , Koji Yamanaka
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- International Application: PCT/JP2016/064906 WO 20160519
- International Announcement: WO2017/199400 WO 20171123
- Main IPC: H03F1/56
- IPC: H03F1/56 ; H03F3/60 ; H03F3/68 ; H03F3/21 ; H03F3/193

Abstract:
A high-frequency power amplifier is configured to include plural island patterns (28) in which ends thereof are arranged in the vicinity of a transmission line (23) and other ends thereof are arranged in the vicinity of an end line (24a) in a transmission line (24), a wire (30) for connecting an end of an island pattern (28) and the transmission line (23), and a wire (31) for connecting another end of the island pattern (28) and the end line (24a) of the second transmission line (24), so that a mismatch of the impedance component having a resistance component and a reactance component can be compensated for by changing the number of first connecting members and the number of second connecting members, the first and second connecting members configured to connect an island pattern (28) to the transmission lines (23) and (24).
Public/Granted literature
- US20190131937A1 HIGH-FREQUENCY POWER AMPLIFIER Public/Granted day:2019-05-02
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