Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16296384Application Date: 2019-03-08
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Publication No.: US10763800B2Publication Date: 2020-09-01
- Inventor: Hee Hwan Ji , Tae Ho Kim
- Applicant: MagnaChip Semiconductor, Ltd.
- Applicant Address: KR Cheongju-si
- Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7a4c088b
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H03F3/183 ; H01L29/78 ; H01L21/265 ; H02M1/42 ; H02M3/28 ; H03F1/02

Abstract:
A semiconductor device includes a substrate comprising a WELL region, a gate electrode comprising a gate length disposed on the WELL region, and first and second drift regions which overlap with the gate electrode. The first and second draft regions may overlap with the gate electrode at an overlapping length which is a percentage of the gate length.
Public/Granted literature
- US20190229685A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-07-25
Information query
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