An optical imaging module including a circuit assembly and a lens assembly is provided. The circuit assembly includes holding base, two circuit substrates, image sensor elements, conductive lines, and a multi-lens frame. The image sensor elements are disposed on the holding base. The circuit substrates are disposed on the carrier and surround the image sensor elements. The conductive lines are disposed between the circuit contacts of the circuit substrates and image contacts of the image sensor elements. The multi-lens frame is integrally formed and covered on the circuit substrate and the image sensor elements. The lens assembly may include lens base, two auto lens assemblies, and two drive assemblies. The lens bases can be disposed on the multi-lens frame. The auto lens assembly may have at least two lenses having refractive power. The driving assembly can be electrically connected to the circuit substrate.