Invention Grant
- Patent Title: Over-ear headphone with hinge-free headband
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Application No.: US16237223Application Date: 2018-12-31
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Publication No.: US10764672B2Publication Date: 2020-09-01
- Inventor: Daniel William Clark , Robert Jason Egger
- Applicant: MrSpeakers, LLC
- Applicant Address: US CA San Diego
- Assignee: MrSpeakers, LLC
- Current Assignee: MrSpeakers, LLC
- Current Assignee Address: US CA San Diego
- Agency: Hall Estill Attorneys at Law
- Agent Tyler J. Mantooth
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
An over-ear headphone system can provide optimal comfort, reliability, and fitment with a headband attached to at least one ear cup. The headband may have a first member and a second member that each extends from a rigid coupler. The rigid coupler can be configured to continuously extend about the periphery of the ear cup so that a gimbal connects the rigid coupler and the ear cup at a lateral position on the ear cup.
Public/Granted literature
- US20190208309A1 OVER-EAR HEADPHONE WITH HINGE-FREE HEADBAND Public/Granted day:2019-07-04
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