An imaging device includes LED elements disposed on a first surface of a board to be electrically connected to first and second wiring patterns, and emitting illumination light in an imaging direction of a camera. A first heat dissipation member and second heat dissipation members are mounted onto opposite sides of the board. The first heat dissipation member is disposed opposite to the first surface. Each of the second heat dissipation members is disposed opposite to a second surface in a region including an area opposite to the LED elements via the board.