Invention Grant
- Patent Title: Circuit boards and circuit board assemblies
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Application No.: US15848576Application Date: 2017-12-20
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Publication No.: US10764994B2Publication Date: 2020-09-01
- Inventor: Tran Lin
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Locke Lord LLP
- Agent Scott D. Wofsy; Judy R. Naamat
- Main IPC: G01R31/70
- IPC: G01R31/70 ; H05K1/02 ; H05K3/34 ; G01R31/50 ; H01L23/15 ; H01L23/367 ; H01L23/498 ; H01L23/50 ; H05K1/11 ; H05K1/18 ; H05K3/22

Abstract:
A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect. Methods of testing continuity in electrical assemblies are also disclosed.
Public/Granted literature
- US20180116047A1 CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES Public/Granted day:2018-04-26
Information query
IPC分类: