Invention Grant
- Patent Title: Electronic module
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Application No.: US16104979Application Date: 2018-08-20
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Publication No.: US10765006B2Publication Date: 2020-09-01
- Inventor: Risto Tuominen , Petteri Palm
- Applicant: IMBERATEK, LLC
- Applicant Address: US VA Herndon
- Assignee: IMBERATEK, LLC
- Current Assignee: IMBERATEK, LLC
- Current Assignee Address: US VA Herndon
- Agency: Capitol IP Law Group, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@49ca7ce1
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/538 ; H01L23/552 ; H01L23/00 ; H01L25/10 ; H01L25/00 ; H01L23/544 ; H05K1/02 ; H05K3/46 ; H01L23/29 ; H05K3/28

Abstract:
The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.
Public/Granted literature
- US20180376597A1 Electronic module Public/Granted day:2018-12-27
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