Invention Grant
- Patent Title: Electrolytic copper foil for printed circuit board with low transmission loss
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Application No.: US16694434Application Date: 2019-11-25
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Publication No.: US10765010B2Publication Date: 2020-09-01
- Inventor: Jian-Ming Huang , Yao-Sheng Lai , Jui-Chang Chou
- Applicant: Chang Chun Petrochemical Co., Ltd
- Applicant Address: TW Taipei
- Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
- Current Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
- Current Assignee Address: TW Taipei
- Agency: Nixon Peabody LLP
- Agent Thomas P. Pavelko
- Main IPC: B21C37/00
- IPC: B21C37/00 ; H05K3/38 ; B32B15/08

Abstract:
Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 μm3/μm2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
Public/Granted literature
- US20200253061A1 ELECTROLYTIC COPPER FOIL FOR PRINTED CIRCUIT BOARD WITH LOW TRANSMISSION LOSS Public/Granted day:2020-08-06
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