Invention Grant
- Patent Title: Integrated power module and capacitor module thermal and packaging design
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Application No.: US16283626Application Date: 2019-02-22
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Publication No.: US10765042B1Publication Date: 2020-09-01
- Inventor: Fan Wang , Lihua Chen , Joseph Sherman Kimmel
- Applicant: FORD GLOBAL TECHNOLOGIES, LLC
- Applicant Address: US MI Dearborn
- Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Brooks Kushman P.C.
- Agent David Kelley
- Main IPC: H02B1/48
- IPC: H02B1/48 ; H05K7/02 ; H05K7/20 ; F28D9/00 ; H02G5/02 ; H02M7/00

Abstract:
An integrated capacitor and power module include a power module, an intermediate cold plate, and a capacitor module. The intermediate cold plate has a first side attached to the power module and a second side opposite the first side. The capacitor module is attached to a second side of the intermediate cold plate. The capacitor module includes a plurality of metalized film capacitor cells supported by a metal plate and a base cold plate with a layer of thermal interface material between the metal plate and the base cold plate. A fluid circulation system is operatively connected to the intermediate cold plate to circulate a fluid through the cold plate. The capacitor module includes a housing, a plurality of capacitor cells and first and second busbars. Alternating cell arrays have a P-end and an N-end that are inverted relative to each other.
Public/Granted literature
- US20200275580A1 INTEGRATED POWER MODULE AND CAPACITOR MODULE THERMAL AND PACKAGING DESIGN Public/Granted day:2020-08-27
Information query
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