Invention Grant
- Patent Title: Soil sensor assembly
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Application No.: US15781349Application Date: 2016-12-01
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Publication No.: US10765073B2Publication Date: 2020-09-08
- Inventor: Yossi Haran
- Applicant: CropX Technologies, Ltd.
- Applicant Address: IL Herzliya
- Assignee: CropX Technologies, Ltd.
- Current Assignee: CropX Technologies, Ltd.
- Current Assignee Address: IL Herzliya
- Agency: Greenberg Traurig, LLP
- International Application: PCT/IL2016/000022 WO 20161201
- International Announcement: WO2017/093991 WO 20170608
- Main IPC: G01R27/26
- IPC: G01R27/26 ; A01G25/16 ; G01N33/24 ; G01N27/22

Abstract:
A soil sensor assembly and methods of measuring undisturbed soil are disclosed. The soil sensor assembly can be a volumetric water content (VWC) sensor. The soil sensor assembly can include at least one soil probe. The soil probes can be secured to a support to enable an installation of the soil sensor assembly in a target soil. The soil probes can include helical blades secured concentrically along the support at predefined longitudinal locations. The soil probes can include at least one radiofrequency (RF) electrode secured to the helical blades at a predefined radial distance from a longitudinal axis of the support. The soil sensor assembly can also include at least one electronics unit coupled to the RF electrodes to receive and/or transmit RF signals from the RF electrodes. The soil sensor assembly can enable a self-tapping installation action and/or enable alienating the soil measurements (e.g., by RF electrodes) away from a disturbed soil.
Public/Granted literature
- US20180352760A1 SOIL SENSOR ASSEMBLY Public/Granted day:2018-12-13
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