An immersion cooling system for electronic equipment including a tank adapted to hold a liquid heat transfer fluid into which the electronic equipment can be immersed and a filter assembly(ies) having a filter housing with an inlet and an outlet and containing a filter cartridge. In some embodiments the filter assembly(ies) is adapted to be located in the heat transfer fluid in the tank, such that a cross-sectional area of the filter housing inlet is greater than a cross-sectional area of the filter housing outlet, the filter housing inlet is substantially vertically oriented on a side of the filter housing, the filter cartridge is positioned within the filter housing at an inclined angle relative to the filter housing inlet, and the filter housing outlet is disposed adjacent to a top of the housing. Advantageously, heat generated by the immersed electronic equipment produces a convective flow of heat transfer fluid through the filter housing.