Invention Grant
- Patent Title: Electronic device manufacturing apparatus and electronic device manufacturing method
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Application No.: US15887283Application Date: 2018-02-02
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Publication No.: US10766142B2Publication Date: 2020-09-08
- Inventor: Ken Takano , Minoru Yamamoto
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@681e8506
- Main IPC: B25J9/16
- IPC: B25J9/16 ; B25J9/00 ; B25J15/00 ; B25J13/08 ; B25J19/02 ; B25J15/06

Abstract:
The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.
Public/Granted literature
- US10723026B2 Electronic device manufacturing apparatus and electronic device manufacturing method Public/Granted day:2020-07-28
Information query
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