Invention Grant
- Patent Title: Method for producing skin-covered, expanded bead molded article
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Application No.: US14792763Application Date: 2015-07-07
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Publication No.: US10766166B2Publication Date: 2020-09-08
- Inventor: Tomoo Tokiwa
- Applicant: JSP CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSP CORPORATION
- Current Assignee: JSP CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Bacon & Thomas, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2a61f08d com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7a978479
- Main IPC: B29C44/44
- IPC: B29C44/44 ; B29B11/14 ; B29C44/34 ; B29C44/14 ; C08J9/12 ; C08J9/18 ; C08J9/232 ; B29K23/00 ; B29K105/04 ; B29L9/00 ; B29C51/02 ; B29C48/08 ; B29C48/345 ; B29C48/30 ; B29C48/05 ; B29C48/00
Abstract:
A method for producing a skin-covered molded article including filling polypropylene-based resin expanded beads in a hollow space of a thermoplastic resin skin and feeding steam into the hollow space to fusion-bond the expanded beads together, the expanded beads showing specific DSC characteristics involving a specific high temperature peak(s) with specific heat of fusion.
Public/Granted literature
- US20160017108A1 METHOD FOR PRODUCING SKIN-COVERED, EXPANDED BEAD MOLDED ARTICLE Public/Granted day:2016-01-21
Information query
