Invention Grant
- Patent Title: Resin mold
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Application No.: US15925342Application Date: 2018-03-19
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Publication No.: US10766169B2Publication Date: 2020-09-08
- Inventor: Shinji Matsumoto , Jun Koike
- Applicant: ASAHI KASEI E-MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI E-MATERIALS CORPORATION
- Current Assignee: ASAHI KASEI E-MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@43595c9
- Main IPC: B29C33/58
- IPC: B29C33/58 ; B82Y10/00 ; B82Y40/00 ; G03F7/00

Abstract:
To provide a resin mold which is excellent in adhesion to a substrate, excellent in release properties from a transfer material resin, further excellent in durability of the resin mold itself, and which endures repetition transfer to the transfer material resin, a resin mold of the invention is a resin mold having a fine concavo-convex structure on the surface, and is characterized in that the fluorine element concentration (Es) in a resin mold surface portion is the average fluorine element concentration (Eb) in the resin forming the resin mold or more.
Public/Granted literature
- US20180207841A1 RESIN MOLD Public/Granted day:2018-07-26
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