Invention Grant
- Patent Title: Method and apparatus for forming radius filler kits
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Application No.: US15840793Application Date: 2017-12-13
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Publication No.: US10766212B2Publication Date: 2020-09-08
- Inventor: James R. Kendall , Paul D. Shaw , Raviendra Sidath Suriyaarachchi , Sadie Lee Fieni
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: B29C70/74
- IPC: B29C70/74 ; B29C70/34 ; B29L31/30
Abstract:
A plurality of segments of radius filler is positioned onto a radius filler forming tool. The plurality of segments of radius filler is applied to a stringer in a single placement step.
Public/Granted literature
- US20190176414A1 Method and Apparatus for Forming Radius Filler Kits Public/Granted day:2019-06-13
Information query
