Invention Grant
- Patent Title: Additive manufacturing
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Application No.: US15518477Application Date: 2014-12-15
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Publication No.: US10766246B2Publication Date: 2020-09-08
- Inventor: Krzysztof Nauka , Sivapackia Ganapathiappan , Lihua Zhao , Howard S. Tom , Yan Zhao , Hou T. Ng
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh PC
- International Application: PCT/US2014/070396 WO 20141215
- International Announcement: WO2016/099445 WO 20160623
- Main IPC: B29C64/10
- IPC: B29C64/10 ; B33Y50/02 ; B33Y10/00 ; B29C70/68 ; B29C64/165 ; B29C64/153 ; B29C64/386 ; B33Y30/00 ; B29K77/00
Abstract:
In one example, a non-transitory processor readable medium with instructions thereon that when executed cause an additive manufacturing machine to partially or completely bury a part in layers of molten build material.
Public/Granted literature
- US20170274593A1 ADDITIVE MANUFACTURING Public/Granted day:2017-09-28
Information query
