Invention Grant
- Patent Title: Electric wire processing apparatus, electric wire processing method, and electric wire holding structure
-
Application No.: US15912649Application Date: 2018-03-06
-
Publication No.: US10766733B2Publication Date: 2020-09-08
- Inventor: Kazuhiko Takada
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@61e20a11
- Main IPC: B65H54/58
- IPC: B65H54/58 ; H01B13/012 ; B65H75/28 ; B65H51/14 ; B65H51/18 ; B65H65/00 ; B65H57/16 ; H01R43/28

Abstract:
An electric wire processing apparatus includes a gripping mechanism that grips a part of an electric wire, a driving mechanism that drives the gripping mechanism, an electric wire winding mechanism that winds the electric wire, and a rotating mechanism that rotates and drives the electric wire winding mechanism. The electric wire winding mechanism includes a winding drum, an electric wire clip provided on the winding drum to hold a leading end of the electric wire, and a holding member that holds an electric wire bundle. The driving mechanism moves the gripping mechanism toward the electric wire clip to hold the leading end on the electric wire clip, the rotating mechanism rotates the winding drum so that the electric wire is wound around the winding drum, and the holding member holds the electric wire bundle wound around the winding drum in the annular shape.
Public/Granted literature
- US20180257903A1 Electric Wire Processing Apparatus, Electric Wire Processing Method, and Electric Wire Holding Structure Public/Granted day:2018-09-13
Information query