Invention Grant
- Patent Title: Resin composition, method for producing resin composition, film formation method, and cured product
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Application No.: US15855291Application Date: 2017-12-27
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Publication No.: US10767017B2Publication Date: 2020-09-08
- Inventor: Kunihiro Noda , Hiroki Chisaka , Kazuya Someya , Dai Shiota
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@20e73977
- Main IPC: C08L83/14
- IPC: C08L83/14 ; C08G77/18 ; C09D183/06 ; C08G77/08 ; C08L83/10 ; C08G77/42 ; C08L83/16 ; C08G77/60 ; C07F7/21

Abstract:
A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure, and (II) a mixture of a resin having a polysilane structure and a resin having a polysiloxane structure.
Public/Granted literature
- US20180179338A1 RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, FILM FORMATION METHOD, AND CURED PRODUCT Public/Granted day:2018-06-28
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