Invention Grant
- Patent Title: Disconnect assembly for active cooling of packaged electronics
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Application No.: US16665046Application Date: 2019-10-28
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Publication No.: US10767939B2Publication Date: 2020-09-08
- Inventor: Gerd Schlottig , Stephan Paredes , Ingmar G. Meijer , Thomas Brunschwiler
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris
- Main IPC: F28D1/00
- IPC: F28D1/00 ; H05K7/20 ; F28F9/02

Abstract:
A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.
Public/Granted literature
- US20200072562A1 DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS Public/Granted day:2020-03-05
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