The present disclosure provides techniques for determining plating conditions by numerically analyzing a film-thickness distribution. The disclosed techniques comprise performing electrochemical measurement in an electroplating apparatus; determining electrochemical parameters based on a result of the electrochemical measurement; receiving initial plating conditions for performing a plating process; based on the electrochemical parameters and the initial plating conditions, determining a current density distribution on a surface of a substrate based on a function formula which comprises a variable which represents a position on the substrate; based on the current density distribution, calculating a thickness of a film to be plated on the substrate; and performing the plating process based on final plating conditions corresponding to a calculated film-thickness distribution satisfying a desired film-thickness distribution.