Invention Grant
- Patent Title: Insert molded hinge
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Application No.: US16074455Application Date: 2016-10-07
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Publication No.: US10768672B2Publication Date: 2020-09-08
- Inventor: Yu-Chen So , Chienchih Chiu , Chih-Hsiung Liao , Lien-Chia Chiu
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Tong Rea Bentley & Kim LLC
- International Application: PCT/US2016/056092 WO 20161007
- International Announcement: WO2018/067179 WO 20180412
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
In example implementations, a hinge is provided. The hinge comprises a first hinge plate having at least one opening, where the first hinge plate is coupled to a system cover via at least one fastener fitted through the at least one opening. The hinge comprises a second hinge plate movably coupled to the first hinge plate, where the second hinge plate comprises a tab member that is coupled to a display cover via an insert molding process. The hinge comprises a hinge cap to enclose a portion of the first hinge plate and the second hinge plate that are movable coupled.
Public/Granted literature
- US20190064887A1 INSERT MOLDED HINGE Public/Granted day:2019-02-28
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