Invention Grant
- Patent Title: Smart compression/decompression schemes for efficiency and superior results
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Application No.: US15482803Application Date: 2017-04-09
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Publication No.: US10769818B2Publication Date: 2020-09-08
- Inventor: Abhishek R. Appu , Kiran C. Veernapu , Prasoonkumar Surti , Joydeep Ray , Altug Koker , Eric G. Liskay
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: G06T9/00
- IPC: G06T9/00

Abstract:
A mechanism is described for facilitating smart compression/decompression schemes at computing devices. A method of embodiments, as described herein, includes unifying a first compression scheme relating to three-dimensional (3D) content and a second compression scheme relating to media content into a unified compression scheme to perform compression of one or more of the 3D content and the media content relating to a processor including a graphics processor.
Public/Granted literature
- US20180293778A1 SMART COMPRESSION/DECOMPRESSION SCHEMES FOR EFFICIENCY AND SUPERIOR RESULTS Public/Granted day:2018-10-11
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