Invention Grant
- Patent Title: Electronic component, diaphragm, electronic device, and electronic component manufacturing method
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Application No.: US16195917Application Date: 2018-11-20
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Publication No.: US10770215B2Publication Date: 2020-09-08
- Inventor: Shingo Ito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27edf4a3 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7f0a73ad
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F41/04 ; H01F27/29 ; H01F27/06 ; H01F7/08 ; H01F27/28 ; H05K1/16 ; H05K3/46 ; H05K3/00 ; H05K1/18

Abstract:
An electronic component includes an insulating base material substrate including a first main surface defining a mounting surface, a coil on the insulating base material substrate, and a mounting electrode on the first main surface and connected to the coil. The insulating base material substrate includes insulating base material layers laminated in a lamination direction. The coil includes a coil conductor provided on one of the insulating base material layers and a winding axis extending in the lamination direction. An area of the first main surface is smaller than an area of a section different in area from the first main surface and is closest to the first main surface, among sections parallel or substantially parallel to the first main surface.
Public/Granted literature
- US20190088403A1 ELECTRONIC COMPONENT, DIAPHRAGM, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MANUFACTURING METHOD Public/Granted day:2019-03-21
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |