- Patent Title: Substrate aligning method, substrate receiving method, substrate liquid processing method, substrate aligning apparatus, substrate receiving apparatus, substrate liquid processing apparatus, and substrate processing system
-
Application No.: US15370042Application Date: 2016-12-06
-
Publication No.: US10770283B2Publication Date: 2020-09-08
- Inventor: Keiji Onzuka , Hirozumi Hoshino
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@405d5a34
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/306 ; H01L21/677

Abstract:
A substrate aligning method includes receiving a substrate by moving a substrate support from an outside of an outer periphery toward a central portion of the substrate along the substrate; and aligning the substrate such that the substrate support moves from a position different from a position partially upwardly warped along an outer peripheral edge of the substrate and a position partially downwardly warped along the outer peripheral edge of the substrate toward the central portion of the substrate so as to receive the substrate.
Public/Granted literature
Information query
IPC分类: