Invention Grant
- Patent Title: EPI thickness tuning by pulse or profile spot heating
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Application No.: US16273902Application Date: 2019-02-12
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Publication No.: US10770319B2Publication Date: 2020-09-08
- Inventor: Shu-Kwan Danny Lau , Zhiyuan Ye , Zuoming Zhu , Nyi O. Myo , Errol Antonio C. Sanchez , Schubert S. Chu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; B23K26/0622

Abstract:
Embodiments described herein provide processing chambers that include an enclosure for a processing volume, a rotatable support within the enclosure, the support having a shaft that extends outside the enclosure, wherein the shaft has a signal feature located outside the processing volume, an energy module within the enclosure, wherein the shaft extends through the energy module, one or more directed energy sources coupled to the enclosure, and one or more signalers positioned proximate to the signal feature, each signaler coupled to at least one of the directed energy sources.
Public/Granted literature
- US20190267263A1 EPI THICKNESS TUNING BY PULSE OR PROFILE SPOT HEATING Public/Granted day:2019-08-29
Information query
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