Invention Grant
- Patent Title: Contact structure and method of fabricating the same
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Application No.: US16016962Application Date: 2018-06-25
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Publication No.: US10770356B2Publication Date: 2020-09-08
- Inventor: Wan Hsuan Hsu , I-Hsiu Wang , Yean-Zhaw Chen , Cheng-Wei Chang , Yu Shih Wang , Hsin-Yan Lu , Yi-Wei Chiu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/417 ; H01L21/768 ; H01L21/311 ; H01L29/66 ; H01L29/78 ; H01L21/02 ; H01L21/027 ; H01L27/02 ; H01L29/08 ; H01L27/088

Abstract:
An apparatus includes a first source and a common drain and on opposite sides of a first gate surrounded by a first gate spacer, a second source and the common drain on opposite sides of a second gate surrounded by a second gate spacer, a first protection layer formed along a sidewall of the first gate spacer, wherein a top surface of the first protection layer has a first slope, a second protection layer formed along a sidewall of the second gate spacer, wherein a top surface of the second protection layer has a second slope, a lower drain contact between the first gate and the second gate and an upper drain contact over the lower drain contact and between the first gate and the second gate, wherein at least a portion of the upper drain contact is in contact with the first slope and the second slope.
Public/Granted literature
- US20180308761A1 Contact Structure and Method of Fabricating the Same Public/Granted day:2018-10-25
Information query
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