Invention Grant
- Patent Title: Fluid routing devices and methods for cooling integrated circuit packages
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Application No.: US15274335Application Date: 2016-09-23
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Publication No.: US10770372B2Publication Date: 2020-09-08
- Inventor: Ravi Gutala , Arif Rahman , Aravind Dasu , Thomas Sarvey , Devdatta Kulkarni
- Applicant: Altera Corporation
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agent Steven J. Cahill
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L23/367 ; H01L23/46 ; H01L23/34 ; G06F1/20 ; G06F30/39 ; G06F30/398 ; H01L21/48 ; H01L23/40 ; G06F119/08

Abstract:
A fluid routing device includes a fluid inlet, first vertical channels, a horizontal channel, a second vertical channel, and a fluid outlet. The first vertical channels are open to the fluid inlet. The horizontal channel is open to each of the first vertical channels. The first vertical channels are oriented to provide fluid coolant from the fluid inlet vertically down to the horizontal channel. The horizontal channel is open on one side such that fluid coolant in the horizontal channel directly contacts an apparatus attached to a bottom of the fluid routing device. The second vertical channel is open to the horizontal channel. The second vertical channel is oriented to provide fluid coolant vertically up away from the horizontal channel. The fluid outlet is open to the second vertical channel such that fluid coolant from the second vertical channel exits the fluid routing device through the fluid outlet.
Public/Granted literature
- US20180090417A1 Fluid Routing Devices And Methods For Cooling Integrated Circuit Packages Public/Granted day:2018-03-29
Information query
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