Invention Grant
- Patent Title: Wiring board, electronic device, and wiring board manufacturing method
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Application No.: US16124730Application Date: 2018-09-07
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Publication No.: US10770386B2Publication Date: 2020-09-08
- Inventor: Toshiki Iwai , Daisuke Mizutani
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Nagano
- Assignee: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Current Assignee: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Current Assignee Address: JP Nagano
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7de7641a
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H05K3/28 ; H01L21/48 ; H01L23/00 ; H05K1/11 ; H05K1/02 ; H05K3/34

Abstract:
A wiring board includes: an insulating layer that includes a first surface over which an electronic component is mounted and a second surface opposite to the first surface; a conductive layer that is disposed on the second surface; a via that is provided inside a first through-hole that penetrates a portion between the first surface and the second surface of the insulating layer; an electrode that is disposed on the first surface and connected to the via; and a glass plate that is not contact with the conductive layer and is disposed on the first surface and includes a second through-hole through which the electrode is disposed.
Public/Granted literature
- US10734316B2 Wiring board, electronic device, and wiring board manufacturing method Public/Granted day:2020-08-04
Information query
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