Invention Grant
- Patent Title: BEOL thin film resistor
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Application No.: US15925835Application Date: 2018-03-20
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Publication No.: US10770393B2Publication Date: 2020-09-08
- Inventor: Andrew Tae Kim , Baozhen Li , Ernest Y. Wu , Chih-Chao Yang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L23/522 ; H01L23/525 ; H01L27/01 ; H01L21/768 ; H01L23/532

Abstract:
Back end of the line precision resistors that allow for high currents and for configuration as an eFuse by embedding a single thin film high resistive metal material within a dielectric layer, wherein the resisters are coupled to sidewalls of adjacent metal interconnects are described. The resistors can be formed in the metal one (M1) dielectric layer and can be coupled to sidewalls of the M1 interconnects. Also described are processes for fabricating integrated circuits including the resistors and/or e-Fuses.
Public/Granted literature
- US20190295947A1 BEOL THIN FILM RESISTOR Public/Granted day:2019-09-26
Information query
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