Invention Grant
- Patent Title: Semiconductor module
-
Application No.: US16322401Application Date: 2017-05-12
-
Publication No.: US10770400B2Publication Date: 2020-09-08
- Inventor: Naoki Kato , Shogo Mori , Harumitsu Sato , Hiroki Watanabe , Hiroshi Yuguchi , Yuri Otobe
- Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Applicant Address: JP Aichi
- Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Current Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Current Assignee Address: JP Aichi
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1dd1fe42
- International Application: PCT/JP2017/018052 WO 20170512
- International Announcement: WO2018/025463 WO 20180208
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/538 ; H01L25/18 ; H01L23/48 ; H01L23/00 ; H01L25/07 ; H01L25/065
Abstract:
A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.
Public/Granted literature
- US20190172788A1 SEMICONDUCTOR MODULE Public/Granted day:2019-06-06
Information query
IPC分类:
