- Patent Title: Clamping system, wire bonding machine, and method for bonding wires
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Application No.: US15472812Application Date: 2017-03-29
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Publication No.: US10770423B2Publication Date: 2020-09-08
- Inventor: Qi Liu
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@32ede8c6
- Main IPC: B23K20/00
- IPC: B23K20/00 ; H01L23/00 ; B23K20/26 ; B23K101/40 ; B23K101/42
Abstract:
A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.
Public/Granted literature
- US20170301644A1 CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES Public/Granted day:2017-10-19
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