Invention Grant
- Patent Title: Clock architecture in heterogeneous system-in-package
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Application No.: US16146716Application Date: 2018-09-28
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Publication No.: US10770443B2Publication Date: 2020-09-08
- Inventor: Karthik Chandrasekar , Shreepad Panth , Ravi Prakash Gutala
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder PC
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/00 ; H03L7/081 ; H03K19/17796 ; H01L23/538

Abstract:
An integrated circuit device that may include programmable logic fabric disposed on an integrated circuit die and a base die that may include clocking circuitry. Synchronization between logic resources in the programmable logic fabric may be performed using clock signals received from the clocking circuitry. The clocking circuitry in the base die may include phase-locked loops, delay-locked loops, clock trees, and other similar circuitry.
Public/Granted literature
- US20200105732A1 CLOCK ARCHITECTURE IN HETEROGENEOUS SYSTEM-IN-PACKAGE Public/Granted day:2020-04-02
Information query
IPC分类: