Invention Grant
- Patent Title: Integrated standard cell structure
-
Application No.: US16397021Application Date: 2019-04-29
-
Publication No.: US10770449B2Publication Date: 2020-09-08
- Inventor: Fang Chen , Jhon Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/06 ; H01L27/092 ; H01L27/118 ; H01L21/8238

Abstract:
An integrated circuit includes a first standard cell having a first pFET and a first nFET integrated, and having a first dielectric gate on a first standard cell boundary. The integrated circuit further includes a second standard cell being adjacent to the first standard cell, having a second pFET and a second nFET integrated, and having a second dielectric gate on a second standard cell boundary. The integrated circuit also includes a first filler cell configured between the first and second standard cells, and spanning from the first dielectric gate to the second dielectric gate. The first pFET and the second pFET are formed on a first continuous active region. The first nFET and the second nFET are formed on a second continuous active region.
Public/Granted literature
- US20190386000A1 Integrated Standard Cell Structure Public/Granted day:2019-12-19
Information query
IPC分类: