Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16258480Application Date: 2019-01-25
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Publication No.: US10770456B2Publication Date: 2020-09-08
- Inventor: Soichi Yoshida , Hiroshi Miyata
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6e8bd571
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L29/739 ; H01L29/861 ; H01L29/10 ; H01L29/417 ; H01L29/08 ; H01L29/78 ; H01L29/40 ; H01L29/868 ; H01L29/423 ; H01L29/32 ; H01L29/06 ; H01L21/265

Abstract:
A semiconductor device including a semiconductor substrate is provided. The semiconductor substrate includes a transistor region, and the transistor region includes a drift region, a plurality of trench portions, a plurality of emitter regions and a plurality of contact regions, and an accumulation region provided between the drift region and the plurality of emitter regions in a depth direction, and having a higher first-conductivity-type doping concentration than the drift region. A first outermost contact region is an outermost one of the plurality of contact regions in a direction parallel to the first direction, and a length of the first outermost contact region in the first direction is longer than a length in the first direction of one contact region of the plurality of contact regions other than the first outermost contact region, and the accumulation region terminates at a position below the first outermost contact region.
Public/Granted literature
- US20190157264A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-05-23
Information query
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