Invention Grant
- Patent Title: Semiconductor device including super junction structure
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Application No.: US16394653Application Date: 2019-04-25
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Publication No.: US10770541B2Publication Date: 2020-09-08
- Inventor: Franz Hirler , Hans Weber
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2a591578
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/36 ; H01L29/417

Abstract:
A semiconductor device of an embodiment includes transistor cells in a transistor cell area of a semiconductor body. A super junction structure in the semiconductor body includes a plurality of drift sub-regions and compensation sub-regions of opposite first and second conductivity types, respectively, and alternately arranged along a lateral direction. A termination area outside the transistor cell area between an edge of the semiconductor body and the transistor cell area includes first and third termination sub-regions of the first conductivity type, respectively. A second termination sub-region of the second conductivity type is sandwiched between the first and the third termination sub-regions along a vertical direction perpendicular to a first surface of the semiconductor body.
Public/Granted literature
- US20190252492A1 Semiconductor Device Including Super Junction Structure Public/Granted day:2019-08-15
Information query
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