Invention Grant
- Patent Title: Epitaxial substrate for semiconductor elements, semiconductor element, and manufacturing method for epitaxial substrates for semiconductor elements
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Application No.: US16733320Application Date: 2020-01-03
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Publication No.: US10770552B2Publication Date: 2020-09-08
- Inventor: Mikiya Ichimura , Sota Maehara , Yoshitaka Kuraoka
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya-shi, Aichi
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya-shi, Aichi
- Agency: Flynn Thiel, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1850216d
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/20 ; H01L29/66 ; H01L29/205 ; C30B29/38 ; C30B25/02 ; C30B29/40 ; H01L29/36 ; H01L29/778 ; C23C16/30 ; H01L29/207

Abstract:
An epitaxial substrate for semiconductor elements suppresses leakage current and has a high breakdown voltage. The epitaxial substrate for semiconductor elements includes: a semi-insulating free-standing substrate formed of GaN doped with Zn; a buffer layer formed of a group 13 nitride adjacent to the free-standing substrate; a channel layer formed of a group 13 nitride adjacent to the buffer layer; and a barrier layer formed of a group 13 nitride on an opposite side of the buffer layer with the channel layer therebetween, wherein part of a first region consisting of the free-standing substrate and the buffer layer is a second region containing Si at a concentration of 1×1017cm−3 or more, and a minimum value of a concentration of Zn in the second region is 1×1017cm−3.
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