Invention Grant
- Patent Title: Gate structure and methods of forming metal gate isolation
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Application No.: US16397224Application Date: 2019-04-29
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Publication No.: US10770559B2Publication Date: 2020-09-08
- Inventor: Chun-Sheng Liang , Meng-Fang Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/423

Abstract:
A method of forming high-k metal gates (HKMGs) includes removing a dummy gate structure formed over a first fin and a second fin to form a trench that exposes portions of the first fin and the second fin, forming a high-k dielectric layer over the exposed portions of the first fin and the second fin, forming a capping layer over the high-k dielectric layer, forming a hard mask layer over the capping layer, such that the hard mask layer fills the trench completely, forming an isolation feature in the hard mask layer between the first fin and the second fin, the isolation feature having sidewalls that extend through the capping layer, removing the hard mask layer to expose the capping layer and the sidewalls of the isolation feature, and forming a conductive electrode over the capping layer and along the sidewalls of the isolation feature.
Public/Granted literature
- US20190334003A1 Gate Structure and Methods of Forming Metal Gate Isolation Public/Granted day:2019-10-31
Information query
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