Invention Grant
- Patent Title: Method of manufacturing light emitting device
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Application No.: US16231105Application Date: 2018-12-21
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Publication No.: US10770618B2Publication Date: 2020-09-08
- Inventor: Yoshikazu Matsuda
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Foley & Lardner LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/48

Abstract:
A method for manufacturing a light emitting device includes providing an intermediate member including: at least one light emitting element that includes a plurality of electrodes arranged at a same surface side thereof, and a covering member covering the at least on light emitting element such that at least a portion of a surface of each of the plurality of electrodes is exposed; forming a metal layer that continuously covers the exposed portion of each of the electrodes and the covering member; and removing a portion of the metal layer by irradiating the metal layer with laser light to form a plurality of external connection electrodes that are spaced apart from each other, each of the plurality of external connection electrodes having an area larger than an area of respective one of the plurality of electrodes.
Public/Granted literature
- US20190123236A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2019-04-25
Information query
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